Flip Chip technology with blind-hole-clips-bump attachment

In this paper, we describe an alternative assembling technique for flip chip mounting without heating processes and discuss the method's advantages and limitations. The proposed construction is an Al substrate with blind-holes and clips chip attachment. Bumps on the die are made by electro-chemical deposition, in combination with a litographically applied mask. The electrical contact is obtained through a kind of clips - the microchemically thickened contact pads on the Al substrate. The blind holes for the die bumps in the Al substrate are made by etching. In cases of high requirements of shock-hardiness the glob-top plastic should be coated over the die on the substrate. Limitations of this method might be the level of electrical and thermal resistance of the contact, which we are studying now. If these conditions are adjusted properly, it is possible to solve the die testing, repairing and high temperature chip-bonding problems in MCM.

[1]  M. Gospodinova,et al.  A new concept for the use of Al‐sheet as integrated substrate for one or multichip module package , 1998 .

[2]  A. Dasgupta,et al.  Impact of underfill filler particles on reliability of flip chip interconnects , 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).

[3]  Sudipta K. Ray,et al.  Flip-chip interconnection technology for advanced thermal conduction modules , 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.

[4]  Abhijit Dasgupta,et al.  Impact of underfill filler particles on reliability of flip chip interconnects , 1997 .

[5]  K. Suzuki,et al.  Conductive adhesive materials for lead solder replacement , 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).

[6]  Toru Ishida,et al.  Flip chip MPU module on high performance printed circuit board "ALIVH" , 1998, Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).

[7]  S. Kang,et al.  Development of high conductivity lead (Pb)-free conducting adhesives , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.