MODEL OF ASSEMBLING PROCESS FOR ELECTRONIC PARTS INTEGRATED IN MECHATRONIC PRODUCTS

The electronic modules as parts of mechatronic products usually consist in printed circuit boards (PCB) having a complex interconnection structure and important contributions regarding the reliability of the mechatronic final products. The high level of reliability in condition of cost optimised request achieving "zero defects" in assembling stage using modern surface mounted technologies (SMT), with respect of the constrains resulted by analysing entire life cycle of a new mechatronic product. In the paper were presented the most important assembling defects and their causes, were identified the Key Process Input Variables (KPIV) and were defined the virtual spaces used for characterization each of all KPIV involved in SMT assembling process from design until manufacturing stage. Practical experiments were designed in order to study the interactions of elements Pad-Paste-Pin-Process as complex functions defined as KPIV of the "4P Soldering Model". The paper proposes 4P Soldering Model as an instrument useful in engineering of the mechatronics product from concept and design phase until manufacturing area in order to assure the high level of the reliability and shortening of the time to market interval in condition of cost optimizing.