论文信息 - Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method - 字舞流文

Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method

John H. Lau | S. W. Ricky Lee | J. Lau | S. Lee

[1] Z. Suo,et al. Mixed mode cracking in layered materials , 1991 .

[2] C. Chang,et al. Real-time popcorn analysis of plastic ball grid array packages during solder reflow , 1998, Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205).

[3] R. Salganik,et al. The strength of adhesive joints using the theory of cracks , 1965 .

[4] M. Kanninen,et al. A finite element calculation of stress intensity factors by a modified crack closure integral , 1977 .

[5] James R. Rice,et al. Elastic Fracture Mechanics Concepts for Interfacial Cracks , 1988 .