Transient thermal management of temperature fluctuations during time varying workloads on portable electronics

This paper describes the investigation of solid to liquid phase change materials (PCM's) for passive energy storage during the condition of time varying workloads on portable electronics. The model investigated includes a thermal control unit (TCU) embedded in an epoxy polymer. A TCU is an enclosure that contains phase change material (PCM) and a thermal conductivity enhancer, is located near the power source, and acts as an energy storage and heat-spreading module. Physical experiments were carried out to investigate the performance improvements of introducing a TCU into an embedded system and were used to validate the accuracy of the numerical model. Numerical simulations were performed to study the effect duty cycles and substrate thermal conductivities have on the thermal performance of the electronic wearable computer system with passive energy storage. Additionally, the TCU was numerically modeled to determine the influence of boundary conditions on TCU performance. To quantify the improvements of the system, metrics were developed from analyzing the thermal evolution of the TCU parameters, such as temperature fields, temperature bands, PCM characteristics, and power loads. Results indicate that using a TCU for passive energy storage significantly increases the portable electronics system's operational performance. Duty cycles with the same average power over the duration of the cycle do not influence the length of the PCM phase change time, but do impact the mean value of the temperature fluctuation bands.

[1]  Lee E. Weiss,et al.  Reflections on a concurrent design methodology: a case study in wearable computer design , 1996, Comput. Aided Des..

[2]  J. Humphrey,et al.  Enhanced heat conduction in phase-change thermal energy storage devices , 1980 .

[3]  A. Patera A spectral element method for fluid dynamics: Laminar flow in a channel expansion , 1984 .

[4]  R. C. Estes The effect of thermal capacitance and phase change on outside plant electronic enclosures , 1992 .

[5]  Yogendra Joshi,et al.  Thermal Management of an Avionics Module Using Solid-Liquid Phase-Change Materials , 1998 .

[6]  P. A. Rice,et al.  HEAT DISSIPATION IN MICROELECTRONIC SYSTEMS USING PHASE CHANGE MATERIALS WITH NATURAL CONVECTION , 1988 .

[7]  Yogendra Joshi,et al.  Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study , 1997 .

[8]  A. Abhat Low temperature latent heat thermal energy storage: Heat storage materials , 1983 .

[9]  Timothy S. Fisher,et al.  Transient thermal management in electronic packaging using dynamic control of power dissipation and heat transfer , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[10]  Timothy S. Fisher,et al.  Transient thermal response due to periodic heating on a convectively cooled substrate , 1996 .

[11]  J. Eftekhar,et al.  Heat Transfer Enhancement in a Paraffin Wax Thermal Storage System , 1984 .

[12]  Daniel P. Siewiorek,et al.  Thermal management and concurrent system design of a wearable multicomputer , 1997 .

[13]  Timothy S. Fisher,et al.  Transient energy management strategies for portable systems , 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

[14]  Cristina H. Amon,et al.  Cooling strategies for embedded electronic components of wearable computers fabricated by shape deposition manufacturing , 1996, InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V.

[15]  Cristina H. Amon,et al.  Spectral element-Fourier method for unsteady conjugate heat transfer in complex geometry flows , 1995 .

[16]  Daniel P. Siewiorek,et al.  Concurrent design and analysis of the Navigator wearable computer system: the thermal perspective , 1994 .