Flexible escape routing for flip-chip designs

In this paper, based on the properties of a hexagonal array for flip-chip designs, a generalized hexagonal array, called alpha -hexagonal array, is proposed to increase the I/O density and reduce the area cost on total routing area. Furthermore, based on the angle assignment for the number of wires through any horizontal channel in alpha-hexagonal array, an efficient column-by-column escape routing strategy is proposed for the proposed a-hexagonal array.

[1]  R. C. Frye,et al.  Flip-chip and chip-scale I/O density requirements and printed wiring board capabilities , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

[2]  Bidyut K. Bhattacharyya,et al.  A method of designing a group of bumps for C4 packages to maximize the number of bumps and minimize the number of package layers , 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

[3]  Y. Takeuchi,et al.  Escape routing design to reduce the number of layers in area array packaging , 2000 .

[4]  E. Winkler.  Escape routing from chip scale packages , 1996, Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium.

[5]  A. Titus,et al.  Innovative circuit board level routing designs for BGA packages , 2004, IEEE Transactions on Advanced Packaging.

[6]  Rui Shi,et al.  Efficient escape routing for hexagonal array of high density I/Os , 2006, 2006 43rd ACM/IEEE Design Automation Conference.