Modeling of Lateral Migration Mechanism During the Retention Operation in 3D NAND Flash Memories
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Myounggon Kang | Hyungcheol Shin | Jaeyeol Park | Jongwook Jeon | Dongiun Lee | Changbeom Woo | Shinkeun Kim | Hyungcheol Shin | J. Jeon | Changbeom Woo | Jaeyeol Park | Shinkeun Kim | Myounggon Kang | Dongiun Lee
[1] Eun-seok Choi,et al. Device considerations for high density and highly reliable 3D NAND flash cell in near future , 2012, 2012 International Electron Devices Meeting.
[2] Dong Woo Kim,et al. Vertical cell array using TCAT(Terabit Cell Array Transistor) technology for ultra high density NAND flash memory , 2006, 2009 Symposium on VLSI Technology.
[3] Myounggon Kang,et al. Analysis of Failure Mechanisms and Extraction of Activation Energies $(E_{a})$ in 21-nm nand Flash Cells , 2013, IEEE Electron Device Letters.
[4] Seongwook Choi,et al. Investigation on multiple activation energy of retention in charge trapping memory using self-consistent simulation , 2014, 2014 44th European Solid State Device Research Conference (ESSDERC).
[5] Byung-Gook Park,et al. Comprehensive analysis of retention characteristics in 3-D NAND flash memory cells with tube-type poly-Si channel structure , 2015, 2015 Symposium on VLSI Technology (VLSI Technology).
[6] Hyungcheol Shin,et al. Accurate Lifetime Estimation of Sub-20-nm NAND Flash Memory , 2016, IEEE Transactions on Electron Devices.
[7] Byung-Gook Park,et al. Space Program Scheme for 3-D NAND Flash Memory Specialized for the TLC Design , 2018, 2018 IEEE Symposium on VLSI Technology.