Process and pad design optimization for 01005 passive component surface mount assembly

Purpose – The ever present need for the miniaturization of electronic assemblies has driven the size of passive components to as small as the 01005 package size. However, the packaging standards for these components are still under development. The purpose of this work is to report results from experiments designed to establish optimum process parameters, pad sizes and component clearances for the surface mounting of 01005 passive components.Design/methodology/approach – The experiments were designed using MODDE, an experimental design software tool, and were carried out with both 01005 capacitors and resistors. All the assembled components were examined under microscope and judged according to industrial workmanship standards.Findings – It was found that a viable solder paste printing process for the assembly of 01005 components can be achieved with a 75 μm thick stencil. Type 5 solder paste achieved a similar printing performance to type 4. Under the experimental conditions used, the optimum pad dimensi...