Semiconductor manufacturing process monitoring using built-in self-test for embedded memories

Memories are often used as a semiconductor manufacturing process monitoring vehicle. This paper describes a new memory built-in self-test (BIST) method that is used to monitor the semiconductor manufacturing process. For this purpose, this BIST method has the ability not only to generate a pass/fail verdict for the tested memory, but also to report additional information to be able to narrow down the type and the location of the failure mode that is causing the tested memory to fail. Also, it offers test algorithm flexibility. The described BIST method has successfully been implemented in a dedicated process monitoring chip that is now being used in large quantities.

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