Wafer positioning method

The invention discloses a wafer locating method, the steps of the method comprise setting coordinate parameters of an alignment mark on a to-be-located wafer, setting coordinate deviation between a to-be-located point of the to-be-located wafer and the alignment mark, utilizing an image obtaining device to separately sample alignment marks of different wafers, and correspondingly generating different mark moulding boards, placing the to-be-located wafer on a wafer holder, sequentially utilizing each mark moulding board to identify the alignment mark on the to-be-located wafer until identifying successfully, defining the center of the alignment mark on the to-be-located wafer as a center coordinate after identifying successfully, and shifting the to-be-located point of the wafer to a center position of a detecting area of the image obtaining device according to the coordinate deviation. The wafer locating method avoids problems of relatively high wafer locating error rate caused by thickness deviation of films in the technique.