A NEW PICK UP & RELEASE METHOD BY HEATING FOR

Micro manipulation is required for assembly and maintenance of micro machines and their parts. In this paper, we propose a new pick up & release method for micromanipulation. The proposed method utiliqe pressure change based on temperature change inside the micro holes made on the endeffector surface. In order to pick up the micro object, endeffector temperature is increased to exceed room temperature before touching the object. After contact with the objec?, its temperature is decreased and negative pressure is generated inside the micro holes to pick it up. To release it, endeffector temperature is increased again. This method realizes quick response due to its scale advantage as long as it is miniaturized in micro order. We made a prototype endeffeczor by Si surface micromachining. We analyzed the static performance of this endeffector and conduc?ed experiments. Finally, effectiveness of the proposed method is shown.