Virtual thermo-mechanical prototyping of electronic packaging-the bottlenecks and solutions for damage modeling

This paper presents the strategy and methodology for virtual thermo-mechanical prototyping of electronic packages specified by Philips. The focus is on the bottlenecks and solutions for damage modeling in virtual thermo-mechanical prototyping. It demonstrates that the capability to understand and develop reliable damage models and criteria at both macro and micro levels is vital for virtual thermo-mechanical prototyping. As a conclusion, by combining the strengths of reliable simulation models with an advanced optimization strategy, virtual prototyping can be used in packaging development to achieve greater business profitability.

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