Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits

A power/ground planes design for efficiently eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period coplanar electromagnetic bandgap (LPC-EBG) structure. Keeping solid for the ground plane and designing an LPC-EBG pattern on the power plane, the proposed structure omnidirectionally behaves highly efficiently in suppression of GBN (over 50 dB) within the broad-band frequency range (over 4 GHz). In addition, the proposed designs suppress radiated emission (or electromagnetic interference) caused by the GBN within the stopband. These extinctive behaviors of low radiation and broad-band suppression of the GBN is demonstrated numerically and experimentally. Good agreements are seen. The impact of the LPC-EBG power plane on the signal integrity for the signals referring to the power plane is investigated. Two possible solutions, differential signals and an embedded LPC-EBG power plane concept, are suggested and discussed to reduce the impact.

[1]  Omar M. Ramahi Near- and far-field calculations in FDTD simulations using Kirchhoff surface integral representation , 1997 .

[2]  Barry Kent Gilbert,et al.  High-frequency characterization of power/ground-plane structures , 1999 .

[3]  Tatsuo Itoh,et al.  Aperture-coupled patch antenna on UC-PBG substrate , 1999 .

[4]  Z. Popovic,et al.  Radiation from ground plane photonic bandgap microstrip waveguides , 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).

[5]  Tzong-Lin Wu,et al.  A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures , 2004, IEEE Microwave and Wireless Components Letters.

[6]  Tzong-Lin Wu,et al.  Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB , 2004, IEEE Transactions on Electromagnetic Compatibility.

[7]  O.M. Ramahi,et al.  A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface , 2003, IEEE Microwave and Wireless Components Letters.

[8]  Tzong-Lin Wu,et al.  Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement , 2001, 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161).

[9]  George V. Eleftheriades,et al.  Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits , 2003 .