论文信息 - Multilayer Organic Multichip Module Implementing Hybrid Microelectromechanical Systems

Multilayer Organic Multichip Module Implementing Hybrid Microelectromechanical Systems

We present the design and development of an organic package that is compatible with fully released RF microelectromechanical systems (MEMS). The multilayer organic package consists of a liquid-crystal polymer film to provide near hermetic cavities for MEMS. The stack is further built up using organic thin-film polyimide. To demonstrate the organic package, we have designed and implemented a 2-bit true-time delay X-band phase shifter using commercially available microelectromechanical switches. The packaged phase shifter has a measured insertion loss of 2.45 plusmn 0.12 dB/bit at 10 GHz. The worst case phase variation of the phase shifter at 10 GHz is measured to less than 5deg. We have also conducted temperature cycling (-65degC to 150degC) and 85/85 to qualify the packaging structures.

[1] Victor M. Bright,et al. Advanced multichip module packaging of microelectromechanical systems , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).

[2] B. K. Gilbert,et al. High-frequency performance of GE high-density interconnect modules , 1992 .

[3] Wolfgang Daum,et al. Overlay high-density interconnect: a chips-first multichip module technology , 1993, Computer.

[4] J. Engel,et al. Liquid crystal polymer (LCP) for MEMS: processes and applications , 2003 .

[5] Anh-Vu Pham,et al. Ultra low loss millimeter wave multichip module interconnects , 1998 .

[6] Michael Pecht,et al. Characterization of polyimides used in high density interconnects , 1994 .

[7] C. Kapusta,et al. Design and Development of a Package Using LCP for RF/Microwave MEMS Switches , 2006, IEEE Transactions on Microwave Theory and Techniques.

[8] Fuhan Liu,et al. Advances in high density interconnect substrate and printed wiring board technology , 2005, 2005 6th International Conference on Electronic Packaging Technology.

[9] J. W. Balde. Crisis in technology: the questionable US ability to manufacture thin-film multichip modules , 1992 .

[10] N. Evers,et al. Development of Multilayer Organic Modules for Hermetic Packaging of RF MEMS Circuits , 2006, 2006 IEEE MTT-S International Microwave Symposium Digest.