Dielectric Characterization of Ultra-Thin Low-Loss Build-Up Substrate for System-in-Package (SiP) Modules

This work proposes a method based on microstrip multi-size T-resonators to increase the accuracy of extracted dielectric characteristics. The dielectric characteristics of an ultra-thin and low-loss build-up substrate for system-in-package modules are obtained, which closely correspond to the measured S-parameters. An electromagnetic simulation is performed to verify the extracted dielectric characteristics. The proposed method is also used to improve the accuracy of prediction of far-field radiated emission at resonant frequencies from a microstrip component.

[1]  M. V. Schneider,et al.  Microstrip lines for microwave integrated circuits , 1969 .

[2]  S. Morgan,et al.  Effect of Surface Roughness on Eddy Current Losses at Microwave Frequencies , 1949 .

[3]  H. A. Wheeler.  Formulas for the Skin Effect , 1942, Proceedings of the IRE.

[4]  Pertti Silventoinen,et al.  A Review of Microstrip T-Resonator Method in Determining the Dielectric Properties of Printed Circuit Board Materials , 2007, IEEE Transactions on Instrumentation and Measurement.

[5]  E. J. Denlinger,et al.  Losses of Microstrip Lines , 1980 .

[6]  Tetsushi Watanabe,et al.  Equivalence of two calculation methods for common-mode excitation on a printed circuit board with narrow ground plane , 2003, 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446).

[7]  V. Sundaram,et al.  Ultra-high density, thin core and low loss organic system-on-package (SOP) substrate technology for mobile applications , 2009, 2009 59th Electronic Components and Technology Conference.

[8]  Tetsushi Watanabe,et al.  Estimation of common-mode EMI caused by a signal line in the vicinity of ground edge on a PCB , 2002, 2002 IEEE International Symposium on Electromagnetic Compatibility.

[9]  E. Hammerstad.  Computer-Aided Design of Microstrip Couplers with Accurate Discontinuity Models , 1981, 1981 IEEE MTT-S International Microwave Symposium Digest.

[10]  D.I. Amey,et al.  Microwave properties of ceramic materials , 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.

[11]  Ching-Wen Hsue,et al.  Novel model for the estimation of radiation emission from printed circuit boards with narrow ground pattern , 2002 .

[12]  A. Milewski,et al.  High-Accuracy Wide-Range Measurement Method for Determination of Complex Permittivity in Reentrant Cavity: Part A --- Theoretical Analysis of the Method , 1980 .

[13]  L. Lewin.  Spurious radiation from microstrip , 1978 .

[14]  R. H. Jansen,et al.  Accurate model for open end effect of microstrip lines , 1981 .

[15]  Richard G. Geyer,et al.  The NIST 60-Millimeter Diameter Cylindrical Cavity Resonator: Performance Evaluation for Permittivity Measurements , 1993 .

[16]  Changyi Su,et al.  Imbalance Difference Model for Common-Mode Radiation From Printed Circuit Boards , 2011, IEEE Transactions on Electromagnetic Compatibility.

[17]  Low cost characterization of the electrical properties of thin film and mold compound for embedded wafer level packaging (EMWLP) , 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

[18]  Tzyy-Sheng Horng,et al.  Estimating the Reduction of Radiated Emissions From Microstrip Components Using Network Analyzer With a Bulk Current Injection Probe , 2013, IEEE Microwave and Wireless Components Letters.

[19]  Kai Chang,et al.  Microwave Ring Circuits and Related Structures , 2004 .

[20]  C. P. Hartwig,et al.  Losses in Microstrip , 1968 .

[21]  M. Cauwe,et al.  Broadband Material Parameter Characterization for Practical High-Speed Interconnects on Printed Circuit Board , 2008, IEEE Transactions on Advanced Packaging.

[22]  E. Belohoubek,et al.  Loss Considerations for Microstrip Resonators (Short Papers) , 1975 .