Line edge roughness (LER) and substrate resist interaction of chemically amplified resists (CAR) might be limitations for future mask making. An alternative solution could be the direct patterning of a thin hard mask on top of an absorber using a multiple ion beam pattern generator. Goal of this work was to assess a resistless hard mask structuring by direct patterning and a subsequent transfer into chrome by a dry etch process. Hard mask structuring has been done on the IMS Nanofabrication proof of concept tool which is designed for 40,000 multi-beam operations. For comparison to the resistless approach, a resist based stack patterning has been set up. Hard mask opening and subsequent chrome etching have been accomplished in a state of the art mask etcher. The assessment of both process schemes has been done in terms of feature profile and resolution capability. Finally, throughput estimation for a future production tool, operating with precursor gases and 1.000.000 ion beams has been calculated.