Channel-bonding CMOS transceiver for 100 Gbps wireless point-to-point links

5G systems and networks are expected to provide unprecedented data-rate to final users and services, in combination with increased coverage and density. The traffic generated at the edges of the network should be hauled through high capacity data-conveyors. Extremely high data-rate links able to provide optical-fiber like performance in the order of 100 Gbps are required to reduce the cost and increase the flexibility of the network infrastructure deployment. This paper presents a full transceiver architecture based on a channel-bonding radio-frequency front-end operating at millimeter-wave frequencies and digital baseband processing units able to provide such data-rates with a feasible implementation in low-cost CMOS technologies. The baseband section of the receiver includes digital compensation algorithms that allow to cope with some of the radio front-end impairments. The main functionalities of the proposed transceiver architecture are validated in hardware.

[1]  R. Kalbasi,et al.  Single-carrier frequency domain equalization , 2008, IEEE Signal Processing Magazine.

[2]  G. M. Rebeiz,et al.  A 155 GHz 20 Gbit/s QPSK transceiver in 45nm CMOS , 2014, 2014 IEEE Radio Frequency Integrated Circuits Symposium.

[3]  Gabriel M. Rebeiz,et al.  A 13.2-dBm, 138-GHz I/Q RF-DAC with 64-QAM and OFDM free-space constellation formation , 2017, ESSCIRC 2017 - 43rd IEEE European Solid State Circuits Conference.

[4]  N. Kukutsu,et al.  10-Gbit/s Wireless Link Using InP HEMT MMICs for Generating 120-GHz-Band Millimeter-Wave Signal , 2009, IEEE Transactions on Microwave Theory and Techniques.

[5]  Benjamin Blampey,et al.  A D-band 4-ways power splitter/combiner implemented on a 28nm bulk CMOS process , 2019, 2019 49th European Microwave Conference (EuMC).

[6]  Jian Zhang,et al.  A 10-Gbit/s Wireless Communication Link Using 16-QAM Modulation in 140-GHz Band , 2013, IEEE Transactions on Microwave Theory and Techniques.

[7]  Kenichi Okada,et al.  13.3 A 56Gb/s W-band CMOS wireless transceiver , 2016, 2016 IEEE International Solid-State Circuits Conference (ISSCC).

[8]  Laurent Dussopt,et al.  A 65-nm CMOS Fully Integrated Transceiver Module for 60-GHz Wireless HD Applications , 2011, IEEE Journal of Solid-State Circuits.

[9]  Kenichi Okada,et al.  20.3 A 64-QAM 60GHz CMOS transceiver with 4-channel bonding , 2014, 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC).

[10]  Lars-Erik Wernersson,et al.  A 15-Gb/s Wireless ON-OFF Keying Link , 2014, IEEE Access.

[11]  P. Chevalier,et al.  A 140-GHz double-sideband transceiver with amplitude and frequency modulation operating over a few meters , 2009, 2009 IEEE Bipolar/BiCMOS Circuits and Technology Meeting.

[12]  S. Wagner,et al.  MMIC chipset for 300 GHz indoor wireless communication , 2015, 2015 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS).

[13]  Philippe Ferrari,et al.  A Programmable Frequency Multiplier-by-29 Architecture for Millimeter Wave Applications , 2015, IEEE Journal of Solid-State Circuits.

[14]  Shi Jia,et al.  100 Gbit/s THz Photonic Wireless Transmission in the 350-GHz Band With Extended Reach , 2018, IEEE Photonics Technology Letters.

[15]  W. Marsden I and J , 2012 .

[16]  Lewis Winner,et al.  1972 IEEE International Solid-State Circuits Conference : digest of technical papers : ISSCC , 1969 .

[17]  Kenichi Okada,et al.  13.6 A 42Gb/s 60GHz CMOS transceiver for IEEE 802.11ay , 2016, 2016 IEEE International Solid-State Circuits Conference (ISSCC).

[18]  Herbert Zirath,et al.  Spectrum Efficient D-band Communication Link for Real-time Multi-gigabit Wireless Transmission , 2018, 2018 IEEE/MTT-S International Microwave Symposium - IMS.

[19]  Sorin P. Voinigescu,et al.  A 2×44Gb/s 110-GHz Wireless Transmitter with Direct Amplitude and Phase Modulation in 45-nm SOI CMOS , 2013, 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).

[20]  Hugo De Man,et al.  Joint compensation of IQ imbalance and frequency offset in OFDM systems , 2003, GLOBECOM '03. IEEE Global Telecommunications Conference (IEEE Cat. No.03CH37489).

[21]  Ali M. Niknejad,et al.  A 240GHz wideband QPSK receiver in 65nm CMOS , 2014, 2014 IEEE Radio Frequency Integrated Circuits Symposium.

[22]  V. Dyadyuk,et al.  A Multigigabit Millimeter-Wave Communication System With Improved Spectral Efficiency , 2007, IEEE Transactions on Microwave Theory and Techniques.

[23]  T. Schneider,et al.  All Active MMIC-Based Wireless Communication at 220 GHz , 2011, IEEE Transactions on Terahertz Science and Technology.

[24]  Benjamin Blampey,et al.  A D-band 4-ways power splitter/combiner implemented on a 28nm bulk CMOS process , 2019, 2019 14th European Microwave Integrated Circuits Conference (EuMIC).

[25]  Benjamin Blampey,et al.  A 125.5-157 GHz 8 dB NF and 16 dB of Gain D-band Low Noise Amplifier in CMOS SOI 45 nm , 2020, 2020 IEEE/MTT-S International Microwave Symposium (IMS).

[26]  Hyung Chul Park,et al.  16‐QAM OFDM‐Based W‐Band Polarization‐Division Duplex Communication System with Multi‐gigabit Performance , 2014 .

[27]  B. Heinemann,et al.  A 16-QAM 100-Gb/s 1-M Wireless Link With an EVM of 17% at 230 GHz in an SiGe Technology , 2019, IEEE Microwave and Wireless Components Letters.

[28]  Kenichi Okada Millimeter-wave CMOS Transceiver Toward 1Tbps Wireless Communication , 2018 .

[29]  Didier Belot,et al.  A 53-to-68GHz 18dBm power amplifier with an 8-way combiner in standard 65nm CMOS , 2010, 2010 IEEE International Solid-State Circuits Conference - (ISSCC).

[30]  Shi Jia,et al.  120 Gb/s Multi-Channel THz Wireless Transmission and THz Receiver Performance Analysis , 2017, IEEE Photonics Technology Letters.

[31]  L. Pometcu,et al.  Characterization of sub-THz and mmwave propagation channel for indoor scenarios , 2018 .

[32]  Theodore S. Rappaport,et al.  Propagation Measurement System and Approach at 140 GHz-Moving to 6G and Above 100 GHz , 2018, 2018 IEEE Global Communications Conference (GLOBECOM).

[33]  Dominique Morche,et al.  Sensitivity of MC-CDMA Systems to Carrier Phase Noise : a large system analysis , 2005, 2005 IEEE 16th International Symposium on Personal, Indoor and Mobile Radio Communications.

[34]  Antonio Clemente,et al.  Transmitarray Antenna with Integrated Frequency Multiplier for High-speed D-band Communications in Low-cost PCB Technology , 2019, 2019 13th European Conference on Antennas and Propagation (EuCAP).

[35]  Patrick Reynaert,et al.  A 14.8 dBm 20.3 dB Power Amplifier for D-band Applications in 40 nm CMOS , 2018, 2018 IEEE Radio Frequency Integrated Circuits Symposium (RFIC).

[36]  A. Leuther,et al.  220 GHz wireless data transmission experiments up to 30 Gbit/s , 2012, 2012 IEEE/MTT-S International Microwave Symposium Digest.