Thermal impedance measurement of integrated inductors on bulk silicon substrate

Abstract The article presents the results of transient thermal measurements of a coil integrated in a silicon chip. Based on those measurements and using numerical procedures, thermal impedance, time constant distribution and structure functions were obtained. Next, using simple physical models of heat transfer phenomena, the 3 major time constants of the device under test were calculated, compared with measurement results and explained physically.

[1]  Gilbert De Mey,et al.  A THREE LAYER MODEL FOR THE THERMAL IMPEDANCE OF THE HUMAN SKIN: MODELING AND EXPERIMENTAL MEASUREMENTS , 2015 .

[2]  V. Székely,et al.  Fine structure of heat flow path in semiconductor devices: a measurement and identification method , 1988 .

[3]  V. Szekely,et al.  On the representation of infinite-length distributed RC one-ports , 1991 .

[4]  A. Napieralski,et al.  Frequency sampling approach to the problem of silicon integrated spiral inductors modeling , 2008 .

[5]  Gilbert De Mey,et al.  Influence of substrate thickness on thermal impedance of microelectronic structures , 2007, Microelectron. Reliab..

[6]  P. Guerriero,et al.  Dynamic electrothermal simulation of photovoltaic plants , 2015, 2015 International Conference on Clean Electrical Power (ICCEP).

[7]  G. De Mey,et al.  Thermal Characterization of Electronic Packages Using the Nyquist Plot of the Thermal Impedance , 2007, IEEE Transactions on Components and Packaging Technologies.

[8]  G. Mey,et al.  Thermal analysis of integrated spiral inductors , 2013 .

[9]  Gilbert De Mey,et al.  Evaluation of a buried power cable's thermal behavior using phase diagrams and calculation of the phase difference between temperature and power , 2014 .

[10]  Andrzej Kos,et al.  Asynchronous control of modules activity in integrated systems for reducing peak temperatures , 2008, Integr..

[11]  Gilbert De Mey,et al.  Harmonic analysis of dynamic thermal problems in high voltage overhead transmission lines and buried cables , 2014 .

[12]  Gilbert De Mey,et al.  Dynamic thermal analysis of underground medium power cables using thermal impedance, time constant distribution and structure function , 2013 .

[13]  M. Meterelliyoz,et al.  Compact thermal models for thermally aware design of VLSI circuits , 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

[14]  Andrzej Napieralski,et al.  Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses , 2011, Microelectron. Reliab..

[15]  Andrzej Napieralski,et al.  Thermal analysis of layered electronic circuits with Green's functions , 2007, Microelectron. J..

[16]  A. Napieralski,et al.  Influence of lateral heat diffusion on the thermal impedance measurement of photovoltaic panels , 2013 .

[17]  Kaustav Banerjee,et al.  A Design-Specific and Thermally-Aware Methodology for Trading-Off Power and Performance in Leakage-Dominant CMOS Technologies , 2008, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

[18]  V. Szekely,et al.  Identification of RC networks by deconvolution: chances and limits , 1998 .