LCD Module PCB의 팽창력 억제에 관한 연구

The alignment miss error between PCB PAD and Drive IC Lead on the LCD Panel Bonding process is caused under the high temperature and pressure condition. We figured out the main cause of PCB expansion via simulation and experiment. Main factor of PCB expansion is PCB Layer sheet and filler resin. We suggested a new PCB layer specifications based on the experiments. The new PCB layer is composed by two sheets of Prepreg and increased contents of filler. The final experimental result shows that the New PCB layer reduces 20% of X-axis transformation than reference PCB layer.