Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system

Abstract In this study, a multifunctional micro-moire interferometry (M 3 I) system is developed for the measurement of in-situ deformation of microelectronic packages. Firstly, the system is applied to measure the in-situ deformation of solder interconnections in a plastic ball grid array (PBGA) assembly subjected to temperature cycling (TC) loading. The experimental results demonstrate that by combining with fatigue life prediction model the system can be used as a quick and accurate experimental tool for the assessment of long-term reliability of microelectronic packages. Secondly, with a specially designed brazil nut (BN) loading fixture, the system is employed to determine the displacement field around the tip of interfacial crack in a solder joint under different mechanical loading configurations. The effective critical fracture toughness and mode mixity of the solder/copper interface are determined with the system. Those results are further used to explain the failure mode and mechanism of solder joint during the reliability experiments.

[1]  J. Lau,et al.  Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies , 1996 .

[2]  S. V. Harren,et al.  On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder , 1996 .

[3]  Z. P. Wang,et al.  Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy , 1999 .

[4]  Bongtae Han,et al.  Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods , 1996 .

[5]  Y. C. Chan,et al.  Nondestructive defect detection in multilayer ceramic capacitors using an improved digital speckle correlation method with wavelet packet noise reduction processing , 2000 .

[6]  James R. Rice,et al.  Elastic Fracture Mechanics Concepts for Interfacial Cracks , 1988 .

[7]  J. Dundurs.  Discussion: ``Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading'' (Bogy, D. B., 1968, ASME J. Appl. Mech., 35, pp. 460-466) , 1969 .

[8]  H.L.J. Pang,et al.  Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy , 2000 .

[9]  H. Solomon.  Fatigue of 60/40 Solder , 1986 .

[10]  H.L.J. Pang,et al.  Investigation of effect of temperature and strain rate on mechanical properties of underfill material by use of microtensile specimens , 2002 .

[11]  David B. Bogy,et al.  Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading , 1968 .

[12]  이혁,et al.  반도체패키지 구성요소의 재료물성치와 기하학적 형상이 여러 형태의 패키지균열에 미치는 영향에 대한 파괴역학적 연구 ( A Fracture Mechanics Analysis of the Effects of Material Properties and Geometries of Components on Various Types of Package Cracks ) , 1995 .

[13]  Bongtae Han,et al.  Recent advancements of moiré and microscopic moiré interferometry for thermal deformation analyses of microelectronics devices , 1998 .

[14]  Z. P. Wang,et al.  Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy , 2003 .

[15]  Bongtae Han,et al.  Observing real-time thermal deformations in electronic packaging , 2002 .

[16]  Bongtae Han,et al.  Determination of an effective coefficient of thermal expansion of electronic packaging components: a whole-field approach , 1996 .

[17]  K. Banerji,et al.  Constitutive relations for tin-based-solder joints , 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

[18]  Zhigang Suo,et al.  Sandwich test specimens for measuring interface crack toughness , 1989 .

[19]  Herbert Reichl,et al.  Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[20]  Bongtae Han,et al.  Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry , 1995 .

[21]  I. Noyan,et al.  Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys , 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

[22]  Z. Suo,et al.  Mixed mode cracking in layered materials , 1991 .

[23]  N. Sottos,et al.  Mechanical characterization of plastic ball grid array package flexure using moire interferometry , 2000 .

[24]  J. Lau,et al.  Solder joint reliability of fine pitch surface mount technology assemblies , 1989, Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,.

[25]  I. K. Hui,et al.  Fatigue life estimation of surface mount solder joints , 1996 .

[26]  Richard W. Neu,et al.  Deformation Behavior of Two Lead-Free Solders: Indalloy 227 and Castin Alloy , 1999 .

[27]  Hai Ding,et al.  Warpage measurement comparison using shadow moire and projection moire methods , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[28]  Wei Zhou,et al.  A modified energy-based low cycle fatigue model for eutectic solder alloy , 1999 .

[29]  H. D. Solomon,et al.  Energy Approach to the Fatigue of 60/40 Solder: Part I—Influence of Temperature and Cycle Frequency , 1995 .

[30]  Dongil Kwon,et al.  Evaluation of thermal shear strains in flip-chip package by electronic speckle pattern interferometry (ESPI) , 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).

[31]  Shi Xunqing,et al.  Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part II: Reliability experiment and numerical simulation , 2002 .

[32]  Edward Chan-Jiun Jih,et al.  Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints , 1993 .

[33]  Dai Fulong,et al.  Study of failure modes of microelectronic packaging modules by holography quasi projection moire method , 1997 .

[34]  戴福隆,et al.  STUDY OF FAILURE MODES OF MICROELECTRONIC PACKAGING MODULES BY HOLOGRAPHY QUASI PROJECTION MOIRE METHOD , 1997 .

[35]  S. Knecht,et al.  Constitutive relation and creep-fatigue life model for eutectic tin-lead solder , 1990 .

[36]  Wei Zhou,et al.  A New Creep Constitutive Model for Eutectic Solder Alloy , 2002 .

[37]  Hsien-Yang Yeh,et al.  Validation of electronic package reliability using speckle interferometry , 2002 .