The role of universities in electronic packaging engineering
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J.L. Prince | Z. J. Staszak | D.J. Hamilton | Z.J. Staszak | E.M. Matz | D. Hamilton | J. Prince | Eileen M. Matz
[1] T. Lewis,et al. VLSI Thermal Management in Cost Driven Systems , 1982 .
[2] L. Schaper,et al. Improved Electrical Performance Required for Future MOS Packaging , 1983 .
[3] E. Davidson. Electrical Design of a High Speed Computer Packaging System , 1983 .
[4] R. Pease,et al. High-performance heat sinking for VLSI , 1981, IEEE Electron Device Letters.
[5] D. Waller,et al. Analysis of Surface Mount Thermal and Thermal Stress Performance , 1983 .
[6] L. Olson,et al. Application of the Finite Element Method to Determine the Electrical Resistance, Inductance, Capacitance parameters for the Circuit Package Enviornment , 1982 .