Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials.
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E. Pop | R. Dauskardt | K. Goodson | Scott G. Isaacson | J. Tice | M. Barako | F. Lian | Feifei Lian
暂无分享,去创建一个
E. Pop | R. Dauskardt | K. Goodson | Scott G. Isaacson | J. Tice | M. Barako | F. Lian | Feifei Lian