Reliability of Lead-Free Solder Joints

Reliability of the restriction of the use of certain hazardous substances in electrical and electronic equipment compliant products is investigated in this study. Emphasis is placed on the lead-free solder joint reliability. Solder is the electrical and mechanical "glue" of electronics assemblies. Will lead-free solders provide the characteristics necessary to allow the world to depend on it in the future? This paper cannot answer this question; however, it will help all participants in the soldering world better understand what needs to be done in order to answer this question and plan for the future.

[1]  J. H. Lau,et al.  Experimental and statistical analyses of surface-mount technology PLCC solder-joint reliability , 1988 .

[2]  John H. Lau,et al.  Reliability testing and data analysis of lead‐free solder joints for high‐density packages , 2004 .

[3]  J. Lau,et al.  Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch , 2002 .

[4]  John H. Lau,et al.  Failure analysis of lead‐free solder joints for high‐density packages , 2004 .

[5]  J. Lau,et al.  A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints , 2005 .

[6]  K. Tu.  Recent advances on electromigration in very-large-scale-integration of interconnects , 2003 .

[7]  J. Lau,et al.  Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board , 2002 .

[8]  J. Lau,et al.  Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies , 1996 .

[9]  John H. Lau,et al.  Microvias: For Low Cost, High Density Interconnects , 2001 .

[10]  John H. Lau,et al.  Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials , 2002 .

[11]  John H. Lau,et al.  Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards) , 2005 .

[12]  P. Vianco,et al.  Acceleration models, constitutive equations, and reliability of lead-free solders and joints , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[13]  J. Lau,et al.  Design for lead‐free solder joint reliability of high‐density packages , 2004 .

[14]  Wataru Nakayama,et al.  Electronic Packaging: Design, Materials, Process, and Reliability , 1998 .