Reducing the number of sensors under hot spot temperature error bound for microprocessors based on dual clustering

On-chip thermal sensors are employed by dynamic thermal management (DTM) techniques to appropriately manage chip performance. However, the effectiveness of the DTM mechanisms is directly dependent on the number of placed sensors, which should be minimised, while guaranteeing accurate tracking of hot spots and full thermal characterisation. In this study, the authors propose a rigid sensor allocation and placement technique for determining the fewest number of thermal sensors and the optimal locations based on dual clustering. Initially, the authors utilise the dual clustering algorithm to devise method that can reduce the number of sensors to a great extent while satisfying an expected accuracy of hot spot temperature error. Then they identify an optimal physical location for each sensor such that the accuracy of full thermal characterisation is maximised. They also propose a flexible sensor computation technique which combines the measurements of the rigid sensors in an optimal way to precisely estimate the temperatures where no sensors are embedded, which can further improve the hot spots tracking resolution. Experimental results indicate the superiority of the authors techniques and confirm that their proposed methods are capable of accurately characterising the temperatures of microprocessors.

[1]  Seda Ogrenci Memik,et al.  Optimizing Thermal Sensor Allocation for Microprocessors , 2008, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[2]  Tajana Simunic,et al.  Proactive temperature management in MPSoCs , 2008, Proceeding of the 13th international symposium on Low power electronics and design (ISLPED '08).

[3]  Tulika Mitra,et al.  Dynamic thermal management via architectural adaptation , 2009, 2009 46th ACM/IEEE Design Automation Conference.

[4]  Kevin Skadron,et al.  HotSpot: a compact thermal modeling methodology for early-stage VLSI design , 2006, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

[5]  Karthick Rajamani,et al.  Thermal response to DVFS: analysis with an Intel Pentium M , 2007, Proceedings of the 2007 international symposium on Low power electronics and design (ISLPED '07).

[6]  Sherief Reda,et al.  Spectral techniques for high-resolution thermal characterization with limited sensor data , 2009, 2009 46th ACM/IEEE Design Automation Conference.

[7]  Li Shang,et al.  Power, Thermal, and Reliability Modeling in Nanometer-Scale Microprocessors , 2007, IEEE Micro.

[8]  Yufu Zhang,et al.  Accurate temperature estimation using noisy thermal sensors , 2009, 2009 46th ACM/IEEE Design Automation Conference.

[9]  Marina L. Gavrilova,et al.  Voronoi diagram in optimal path planning , 2007, 4th International Symposium on Voronoi Diagrams in Science and Engineering (ISVD 2007).

[10]  Weihua Wang Reach on Sobel Operator for Vehicle Recognition , 2009, 2009 International Joint Conference on Artificial Intelligence.

[11]  Norman P. Jouppi,et al.  CACTI: an enhanced cache access and cycle time model , 1996, IEEE J. Solid State Circuits.

[12]  Richard E. Kessler,et al.  The Alpha 21264 microprocessor , 1999, IEEE Micro.

[13]  John L. Henning SPEC CPU2000: Measuring CPU Performance in the New Millennium , 2000, Computer.

[14]  Seda Ogrenci Memik,et al.  Systematic temperature sensor allocation and placement for microprocessors , 2006, 2006 43rd ACM/IEEE Design Automation Conference.

[15]  Sherief Reda,et al.  Improved Thermal Tracking for Processors Using Hard and Soft Sensor Allocation Techniques , 2011, IEEE Transactions on Computers.

[16]  Bin Zou,et al.  Self-organizing dual clustering considering spatial analysis and hybrid distance measures , 2011 .

[17]  Seda Ogrenci Memik,et al.  Thermal monitoring mechanisms for chip multiprocessors , 2008, TACO.

[18]  Margaret Martonosi,et al.  Wattch: a framework for architectural-level power analysis and optimizations , 2000, Proceedings of 27th International Symposium on Computer Architecture (IEEE Cat. No.RS00201).

[19]  Xin Li,et al.  Inverse Distance Weighting Method Based on a Dynamic Voronoi Diagram for Thermal Reconstruction with Limited Sensor Data on Multiprocessors , 2011, IEICE Trans. Electron..

[20]  Yufu Zhang,et al.  Accurate Temperature Estimation Using Noisy Thermal Sensors for Gaussian and Non-Gaussian Cases , 2011, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

[21]  Lei He,et al.  Temperature and supply Voltage aware performance and power modeling at microarchitecture level , 2005, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[22]  Ming-Syan Chen,et al.  Dual Clustering: Integrating Data Clustering over Optimization and Constraint Domains , 2005, IEEE Trans. Knowl. Data Eng..

[23]  Sheng-Chih Lin,et al.  Cool Chips: Opportunities and Implications for Power and Thermal Management , 2008, IEEE Transactions on Electron Devices.

[24]  Todd M. Austin,et al.  The SimpleScalar tool set, version 2.0 , 1997, CARN.

[25]  Sherief Reda,et al.  Thermal monitoring of real processors: Techniques for sensor allocation and full characterization , 2010, Design Automation Conference.