Thermoelectric cooling for power electronics circuits: Small signal modeling and controller design

This paper discusses the modeling and application of Thermoelectric Cooling (TEC) in power electronics circuits, with the focus on the small signal modeling and controller design. In this paper, the small signal analysis based on a comprehensive thermoelectric model is carried out and the results show that, the whole system is a non-minimum-phase system and lack of damping to the disturbance in the control variable. A closed loop controller is designed to solve the stability issues and realize dynamic temperature control. To verify the effectiveness of derived small signal model and designed controller, an 8 kW prototype has been built and experimental results are presented in this paper.

[1]  Xiaoxiao Yu,et al.  Control of Parallel Connected Power Converters for Low Voltage Microgrid—Part II: Dynamic Electrothermal Modeling , 2010, IEEE Transactions on Power Electronics.

[2]  O. A. Mohammed,et al.  A physics-based, dynamic electro-thermal model of silicon carbide power IGBT devices , 2013, 2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC).

[3]  Jin Wang,et al.  Minimum power loss control — thermoelectric technology in power electronics cooling , 2009, 2009 IEEE Energy Conversion Congress and Exposition.

[4]  M. Schauer,et al.  Extended temperature tuning of an ultraviolet diode laser for trapping and cooling single Yb+ ions. , 2010, The Review of scientific instruments.

[5]  Francis P. Dawson,et al.  Time-Dependent Finite-Volume Model of Thermoelectric Devices , 2014, IEEE Transactions on Industry Applications.

[6]  Seiichiro Katsura,et al.  Frequency response analysis of observer-based thermal control system of peltier device , 2011, 2011 4th International Conference on Human System Interactions, HSI 2011.

[8]  Frede Blaabjerg,et al.  Thermal and efficiency analysis of five-level multi-level clamped multilevel converter considering grid codes , 2012, ECCE 2012.

[9]  T. Abbas,et al.  CPU thermal management of personal and notebook computer (Transient study) , 2010, 2010 3rd International Conference on Thermal Issues in Emerging Technologies Theory and Applications.

[11]  Pedro Rodriguez,et al.  Electro-thermal modeling for junction temperature cycling-based lifetime prediction of a press-pack IGBT 3L-NPC-VSC applied to large wind turbines , 2011, 2011 IEEE Energy Conversion Congress and Exposition.

[12]  Seiichiro Katsura,et al.  Thermal bilateral control with scaled thermal information using peltier device , 2011, 2011 IEEE/SICE International Symposium on System Integration (SII).

[13]  S. Lineykin,et al.  A Simple and Intuitive Graphical Approach to the Design of Thermoelectric Cooling Systems , 2006 .

[14]  Yinghao Yao,et al.  Research on thermal cycle system for real-time PCR instrument based on equivalent circuit model , 2010, 2010 IEEE International Conference on Automation and Logistics.

[15]  C. Kral,et al.  A fast inverter model for electro-thermal simulation , 2012, 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC).

[16]  Christopher J. Backhouse,et al.  Nonlinear Controller Designs for Thermal Management in PCR Amplification , 2012, IEEE Transactions on Control Systems Technology.

[17]  S. Lineykin,et al.  Modeling and analysis of thermoelectric modules , 2005, APEC 2005.

[18]  A. Bar-Cohen,et al.  Self-Cooling on Germanium Chip , 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[19]  S. Bhattacharya,et al.  Thermal design considerations for 12kV SiC n-IGBT based 3L NPC converter , 2012, 2012 IEEE Energy Conversion Congress and Exposition (ECCE).