Paramagnetic Defect Generation and Microstructure Change in Porous Low-k SiOCH Films with Vacuum Baking
暂无分享,去创建一个
[1] F. Iacopi,et al. Ultraviolet-Assisted Curing of Organosilicate Glass Low-k Dielectric by Excimer Lamps , 2008 .
[2] David Roy,et al. Characterization of low-k SiOCH dielectric for 45nm technology and link between the dominant leakage path and the breakdown localization , 2008 .
[3] Dolores C. Miller,et al. Mechanical Enhancement of Low-k Organosilicates by Laser Spike Annealing , 2008 .
[4] V. Jousseaume,et al. Thermal furnace and Ultraviolet assisted curing impact on SiOCH spin-on ultra low dielectric constant materials , 2008 .
[5] Manabu Kato,et al. A robust k , 2007 .
[6] S. H. Kim,et al. Influence of thermal treatment of low dielectric constant SiOC(H) films using MTES/O2 deposited by PECVD , 2007 .
[7] Seiichi Kondo,et al. Paramagnetic Defect Spin Centers in Porous SiOCH Film Investigated Using Electron Spin Resonance , 2007 .
[8] V. Jousseaume,et al. Comparison Between E-beam and Ultraviolet Curing to Perform Porous a-SiOC : H , 2007 .
[9] R. Navamathavan,et al. Plasma enhanced chemical vapor deposition of low dielectric constant SiOC(–H) films using MTES/O2 precursor , 2007 .
[10] T. Kikkawa,et al. Novel organosiloxane vapor annealing process for improving properties of porous low-k films , 2007 .
[11] V. Jousseaume,et al. Investigation of Porogen Behavior during the Curing Process of Ultralow-k Spin-On Materials Chemical Transformation-Kinetics , 2007 .
[12] Takamaro Kikkawa,et al. Effect of moisture adsorption on the properties of porous-silica ultralow-k films , 2006 .
[13] C. Choi,et al. The characteristics of carbon-doped silicon oxide films with nano-pore structure deposited using UV-assisted PECVD , 2006 .
[14] A. Quaranta,et al. Microstructural Evolution of Thermally Treated Low-Dielectric Constant SiOC : H Films Prepared by PECVD , 2006 .
[15] A. Farcy,et al. Impact of patterning and ashing on electrical properties and reliability of interconnects in a porous SiOCH ultra low-k dielectric material , 2005 .
[16] Rusli,et al. An Electrical, Compositional, and Structural Study on Low-k Silsesquioxane Dielectric Thin Films , 2005 .
[17] Heon-Ju Lee,et al. The effect of the CH4 plasma treatment on deposited SiOC(–H) films with low dielectric constant prepared by using TMS/O2 PECVD , 2005 .
[18] R. Kumar,et al. Investigation of deposition temperature effect on properties of PECVD SiOCH low-k films , 2004 .
[19] A. Grill,et al. Structure of low dielectric constant to extreme low dielectric constant SiCOH films: Fourier transform infrared spectroscopy characterization , 2003 .
[20] Karen Maex,et al. Low dielectric constant materials for microelectronics , 2003 .
[21] Alfred Grill,et al. Ultralow-k dielectrics prepared by plasma-enhanced chemical vapor deposition , 2001 .