Prediction and verification of power/ground plane edge radiation excited by through-hole signal via based on balanced TLM and via coupling model

We introduce a modeling and simulation method to predict power/ground plane resonance and edge radiation coupled from the broken return current path of a through-hole signal via, and analyze the coupling and radiation mechanism. The approach is successfully verified with a series of measurements with various plane conditions.

[1]  Ken Nakano,et al.  Reduction in radiated emission by symmetrical power-ground layer stack-up PCB with no open edge , 2002, 2002 IEEE International Symposium on Electromagnetic Compatibility.

[2]  S. Radu,et al.  An investigation of PCB radiated emissions from simultaneous switching noise , 1999, 1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261).

[3]  H. Sasaki,et al.  Radiated emission from a multilayer PCB with traces placed between power/ground planes , 2002, 2002 IEEE International Symposium on Electromagnetic Compatibility.

[4]  F. Gisin,et al.  Radiation from printed circuit board edge structures , 2001, 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161).

[5]  R. G. Kaires,et al.  Radiated emissions from printed circuit board traces including the effect of vias, as a function of source, termination and board characteristics , 1998, 1998 IEEE EMC Symposium. International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.98CH36253).

[6]  Joungho Kim,et al.  Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB , 2003, 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446).

[7]  C. Balanis.  Antenna theory , 1982 .