For through-silicon optical probing of microprocessors, the heat generated by dev with power over 100W must be dissipated [1]. To accommodate optical probing, a s ingly elaborate cooling system that controls the microprocessor temperature from 6 100°C for device power up to 150 W was designed [2]. The system parameters to ac the desired thermal debug environment were cooling air temperature and air flo mathematical model was developed to determine both device temperature and power. The 3D heat equation that governs the temperature distribution was simplifi a case of a 1D rod with one end at the device center and the other at the coolin intake. Thus the cooling system was reduced to an analytical expression. From e mental data, we computed all coefficients in the model, then ran extensive tests to v the accuracy was better than 10% over the entire temperature and power ran @DOI: 10.1115/1.1826079 #
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