论文信息 - A simple method for evaluating the transient thermal response of semiconductor devices

A simple method for evaluating the transient thermal response of semiconductor devices

Abstract In this paper, a simple experimental method for the transient thermal characterisation of semiconductor packages is presented. The method is based upon the assumption that in many cases, device temperature evolution can be accurately described by a few exponential terms, as will be shown to be the case when transient thermal response has widely separated time constants. The proposed method, begins with the experimental determination of transient thermal response followed by numerical extraction of the time constants and amplitudes for the significant exponential terms, and is applied to a number of commercial Smartpack ® modules in order to obtain a dynamic model that can be used in circuit and numerical simulators, in order to predict the dynamic thermal behaviour of the device under any working condition.

[1] E. J. Diebold,et al. Transient thermal impedance of semiconductor devices , 1961, Transactions of the American Institute of Electrical Engineers Part I Communication and Electronics.

[2] V. Székely,et al. A new evaluation method of thermal transient measurement results , 1997 .

[3] F. N. Masana,et al. Thermal characterisation of power modules , 2000 .

[4] Wai-Kai Chen,et al. The circuits and filters handbook , 2009 .

[5] E. Dallago,et al. Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. I. Fundamentals and theory , 1998 .

[6] F. N. Masana,et al. A new approach to the dynamic thermal modelling of semiconductor packages , 2001, Microelectron. Reliab..

[7] R. Pritchard,et al. Electrical Characteristics of Transistors , 1967 .

[8] Vladimír Székely. Distributed RC Networks , 2001 .

[9] F. N. Masana,et al. The Smartpack(R), a low cost high performance solution for power packaging , 1999 .

[10] J. W. Sofia. Analysis of thermal transient data with synthesized dynamic models for semiconductor devices , 1994 .

[11] William E. Newell,et al. Transient Thermal Analysis of Solid-State Power Devices--Making a Dreaded Process Easy , 1976, IEEE Transactions on Industry Applications.

[12] E. A. S Guillemin,et al. Synthesis of Passive Networks , 1957 .