Controlled intensity emission from patterned porous silicon using focused proton beam irradiation

We have fabricated light emitting porous silicon micropatterns with controlled emission intensity. This has been achieved by direct write irradiation in heavily doped p-type silicon (0.02Ωcm) using a 2MeV proton beam, focused to a spot size of 200nm. After electrochemical etching in hydrofluoric acid, enhanced photoluminescence is observed from the irradiated regions. The intensity of light emission is proportional to the dose of the proton beam, so the PL intensity of the micropattern can be tuned and varied between adjacent regions on a single substrate. This behavior is in contrast to previous ion beam patterning of p-type silicon, as light is preferentially created as opposed to quenched at the irradiated regions.

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