Thermal performance of thin loop-type vapor chamber

Abstract This experimental study examines the thermal performances of a newly devised thin loop-type vapor chamber (VC) of 0.5 mm interior height at the controlled evaporator heat fluxes ( q ) and condenser thermal resistances ( R th , con ) with vertical and horizontal orientations. The capillary layer over the entire heated VC endwall is constructed by the 0.05 mm deep parallel/staggered square grooves with a copper woven wire mesh sintered above the staggered grooves on the evaporator endwall. The vapor–liquid flow images and their responsive overall thermal resistances ( R th ) and effective spreading thermal conductivities ( k eff ) are simultaneously detected with the objective to study the effects of q , R th , con and VC orientation on the vapor–liquid two-phase flow phenomena and the associated heat transfer performances. At various test conditions, the responsive R th and k eff results to the interfacial flow structures, the comparative R th and k eff properties as well as the relative thermal performance improvements from the copper plate for the test VC are examined.

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