Bump Height at Low Temperature Analysis

The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold process time and the bump height. A certain bump height need to be achieved in order to create acceptable solder bumps for reflow process. The study was done using a full factorial design of experiment (DOE). The DOE matrix is made of two levels with two factors. Analysis was done by plotting the main effects plot for each factor. The results suggest that higher process time increases the plating rate where the temperature fixed at 70 °C. Electroless nickel time has more influence to the bump height compared to immersion gold time.

[1]  K. H. Tong,et al.  Development of novel immersion gold for electroless nickel immersion gold process (ENIG) in PCB applications , 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

[2]  Andreas Ostmann,et al.  The pretreatment of aluminum bondpads for electroless nickel bumping , 1993, Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93.

[3]  A. Jalar,et al.  The effects of zincation process on aluminum bond pad surfaces for electroless nickel immersion gold (ENIG) deposition , 2004, 2004 IEEE International Conference on Semiconductor Electronics.

[4]  D. R. Frear,et al.  Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology , 1999 .

[5]  Willem D. van Driel,et al.  Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP , 2008, Microelectron. Reliab..

[6]  Jiju Antony,et al.  Improving the wire bonding process quality using statistically designed experiments , 1999 .

[7]  D. Kwong,et al.  Study of 15µm pitch solder microbumps for 3D IC integration , 2009, 2009 59th Electronic Components and Technology Conference.

[8]  D. Love,et al.  Development of electroless Ni/Au plated build-up flip chip package with highly reliable solder joints , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[9]  R. Vairavan,et al.  Interaction of Surface Roughness and Copper Ball Adhesion Using Shearing Simulation , 2012, 2012 Fourth International Conference on Computational Intelligence, Modelling and Simulation.

[10]  Uda Hashim,et al.  The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition , 2006 .

[11]  Steven Taniselass,et al.  Wire Bond Shear Test Simulation on Sharp Groove Surface Bond Pad , 2012 .