Effect of Ag-alloying addition on the stress temperature behavior of electroplated copper thin films
暂无分享,去创建一个
Klaus Wetzig | Horst Wendrock | Siegfried Menzel | S. Menzel | S. Strehle | H. Wendrock | K. Wetzig | S. Strehle
[1] K. Tu. Recent advances on electromigration in very-large-scale-integration of interconnects , 2003 .
[2] S. Menzel,et al. Thermo-mechanical behavior and microstructural evolution of electrochemically deposited low-alloyed Cu(Ag) thin films , 2004 .
[3] S. Menzel,et al. Microstructural investigation of electrodeposited CuAg-thin films , 2003 .
[4] G. Dixit,et al. Electrodeposition of copper–tin alloy thin films for microelectronic applications , 2003 .
[5] G. Stoney. The Tension of Metallic Films Deposited by Electrolysis , 1909 .
[6] C. Cabral,et al. Annealing behavior of Cu and dilute Cu-alloy films: Precipitation, grain growth, and resistivity , 2003 .
[7] William D. Nix,et al. Mechanical properties of thin films , 1989 .
[8] James R. Lloyd,et al. Electromigration and mechanical stress , 1999 .