Preservation of atomically clean silicon surfaces in air by contact bonding
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[1] B. Meyerson. Low-temperature Si an Si: Ge expitaxy by ultrahigh-vacuum/chemical vapor deposition: process fundamentals , 1990 .
[2] Y. Bäcklund,et al. A suggested mechanism for silicon direct bonding from studying hydrophilic and hydrophobic surfaces , 1992 .
[3] Y. Bäcklund,et al. Spontaneous bonding of hydrophobic silicon surfaces , 1993 .
[4] R. H. Williams,et al. A photoemission study of passivated silicon surfaces produced by etching in solutions of HF , 1989 .
[5] G. S. Higashi,et al. Comparison of Si(111) surfaces prepared using aqueous solutions of NH4F versus HF , 1991 .
[6] Y. Chabal,et al. Silicon wafer bonding studied by infrared absorption spectroscopy , 1994 .
[7] S. Bengtsson,et al. Formation of directly bonded Si/Si interfaces in ultra-high vacuum , 1997 .
[8] Becker,et al. Atomic-scale conversion of clean Si(111):H-1 x 1 to Si(111)-2 x 1 by electron-stimulated desorption. , 1990, Physical review letters.
[9] G. S. Higashi,et al. Infrared spectroscopy of Si(111) and Si(100) surfaces after HF treatment: Hydrogen termination and surface morphology , 1989 .
[10] K. Eda,et al. Direct bonding of quartz crystal onto silicon , 1993 .
[11] U. Gosele,et al. Bubble-Free Silicon Wafer Bonding in a Non-Cleanroom Environment , 1988 .
[12] A. F. Hebard,et al. Materials with a Buried C 60 Layer Produced by Direct Wafer Bonding , 1994 .
[13] E. Janzén,et al. GaAs Low Temperature Fusion Bonding , 1994 .
[14] W. Maszara,et al. Role of surface morphology in wafer bonding , 1991 .
[15] J. Boland. Role of bond-strain in the chemistry of hydrogen on the Si(100) surface , 1992 .