论文信息 - Packaging and interconnection mutual coupling effects in planar structures and discontinuities

Packaging and interconnection mutual coupling effects in planar structures and discontinuities

An integral equation technique that is solved by the method of moments is used to analyze parasitic coupling in general shielded planar structures. The coupling between a planar component and its enclosure and the coupling between planar component themselves are studied. The first effect is illustrated by the calculated values of the effective permittivity of uniform planar lines and the S-parameters for a suspended stripline stub discontinuity for different enclosure geometries. The mutual coupling between two small spaced microstrip stubs is also discussed. Comparison with other numerical results as well as with published experimental ones has verified the accuracy and the numerical efficiency of the present approach.<<ETX>>

J. Citerne | V. Fouad Hanna | C. Amrani | M. Drissi

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