EMC of DSI3 communication protocol — PCB Consideration for Sensor product

This paper deals with EMC testing studies conducted on Sensor devices — accelerometer/inertial sensors. Immunity and Emission performances are carried out to ensure the compliance with market needs. We describe the steps with improvement of PCB layout leading to high immunity level of the system. The paper demonstrates how the PCB layout can contribute to the EMC performance of an application based on a dominant IC.

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