An integrated power electronics modular approach: concept and implementation

Assemblies of power semiconductor switches achieved to some extent, the number of interconnects and their associated drive circuit are at present available in modules. Upward into the multikilowatt range, mixed mode module construction is used. This incorporates monolithic, hybrid, surface mount and wirebond technology. However, a close examination of the applications in motor drives and power supplies indicates that there has been no dramatic volume reduction of the subsystem. The power semiconductor modules have shrunk the power switching part of the converter, but the bulk of the subsystem volume still comprises the associated control, sensing, electromagnetic power passives (inductors, transformers, capacitors) and interconnects. This paper addresses the improvement of power processing technology through advanced integration of power electronics. The goal of a subsystem in a module necessitates this advanced integration, incorporating active switching stages, EMI-filters and electromagnetic power passives into modules. The central philosophy of the technology development research in the National Science Foundation Engineering Research Center for power electronic systems is to advance the state of the art by providing the concept of integrated power electronics modules (IPEMs) for all these functions. The technology underpinning such an IPEM approach is discussed. The fundamental functions in electronic power processing, the materials, processes and integration approaches and future concepts are explained

[1]  Bantval J. Baliga,et al.  The future of power semiconductor device technology , 2001, Proc. IEEE.

[2]  H. Goldstein.  Packages go vertical , 2001 .

[3]  James D. Meindl,et al.  Special issue on limits of semiconductor technology , 2001, Proc. IEEE.

[4]  M. C. Shaw,et al.  Packaging of integrated solid-state power assembly cells: a thermomechanics-based approach , 2001, Proc. IEEE.

[5]  Karen A. Thole,et al.  Electrical and Thermal Layout Design and Optimization Considerations for DPS Active IPEM , 2002 .

[6]  Fred Barlow,et al.  An overview to integrated power module design for high power electronics packaging , 2000 .

[7]  J.D. van Wyk,et al.  Exploiting the third dimension in power electronics packaging , 1997, Proceedings of APEC 97 - Applied Power Electronics Conference.

[8]  J.A. Ferreira,et al.  Some present and future trends in power electronic converters , 1992, Proceedings of the 1992 International Conference on Industrial Electronics, Control, Instrumentation, and Automation.

[9]  J.D. van Wyk,et al.  Technologies and characteristics of integrated EMI filters for switch mode power supplies , 2004, 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551).

[10]  D. Boroyevich,et al.  Power electronics technology: present trends and future developments , 2001, Proceedings of the IEEE.

[11]  M.C. Smit,et al.  Integrated technology and performance for multi-kilowatt power electronic converters-an evaluation , 1993, Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics.

[12]  Zhenxian Liang,et al.  Embedded power-an integration packaging technology for IPEMs , 2000 .

[13]  J.D. van Wyk,et al.  Integration of EMI filter for distributed power system (DPS) front-end converter , 2003, IEEE 34th Annual Conference on Power Electronics Specialist, 2003. PESC '03..

[14]  J.D. van Wyk,et al.  Integration of a 1 MHz converter with active and passive stages , 2001, APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181).

[15]  J.D. van Wyk,et al.  Second order approximation lumped parameter model for planar integrated L-L-C-T module [power conversion] , 2002, Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344).

[16]  J. D. van Wyk,et al.  Power electronics technology at the dawn of a new century-past achievements and future expectations , 2000 .

[17]  J.D. van Wyk,et al.  Volumetric optimal design of passive integrated power electronic module (IPEM) for distributed power system (DPS) front-end DC/DC converter , 2002, Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344).

[18]  B.J. Baliga.  Evolution and status of smart power technology , 1992, [Proceedings] APEC '92 Seventh Annual Applied Power Electronics Conference and Exposition.

[19]  J.D. van Wyk,et al.  Volumetric optimal design of passive integrated power electronic module (IPEM) for distributed power system (DPS) front-end DC/DC converter , 2002, Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344).

[20]  J.D. Van Wyk,et al.  Design of planar integrated passive module for zero-voltage switched asymmetrical half bridge PWM converter , 2001, Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248).

[21]  J.D. van Wyk,et al.  Improved loss determination for planar integrated power passive modules , 2002, APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335).

[22]  Enric Cabruja,et al.  MCM-D package for power applications , 2000, IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426).