A novel high-speed shear test for lead-free flip chip packages

[1]  Jong-Woong Kim,et al.  Failure mechanism of Pb-bearing and Pb-free solder joints under high-speed shear loading , 2010 .

[2]  Z. Zhang,et al.  Ductile-to-brittle transition induced by increasing strain rate in Sn–3Cu/Cu joints , 2008 .

[3]  Kwang-Lung Lin,et al.  The micro-impact fracture behavior of lead-free solder ball joints , 2008 .

[4]  Yi-Shao Lai,et al.  Cyclic bending reliability of wafer-level chip-scale packages , 2007, Microelectron. Reliab..

[5]  Kwang-Lung Lin,et al.  Interfacial microstructure and shear behavior of Sn–Ag–Cu solder balls joined with Sn–Zn–Bi paste , 2006 .

[6]  S. Jung,et al.  Mechanical strength test method for solder ball joint in BGA package , 2005 .

[7]  Toshio Narita,et al.  The effect of strain rate and temperature on the tensile properties of Sn–3.5Ag solder , 2005 .

[8]  Ikuo Shohji,et al.  Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity , 2004 .

[9]  Y. Chan,et al.  Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad , 2003 .

[10]  S. Fujiuchi,et al.  Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints , 2002 .

[11]  Kojiro F. Kobayashi,et al.  Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders , 2002 .

[12]  K. Tu,et al.  Six cases of reliability study of Pb-free solder joints in electronic packaging technology , 2002 .

[13]  Y. L. Lin,et al.  Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni , 2002 .

[14]  K. Tu,et al.  Tin–lead (SnPb) solder reaction in flip chip technology , 2001 .

[15]  Zhengkui Xu,et al.  Thermal stability of electroless-nickel/solder interface: Part A. interfacial chemistry and microstructure , 2000 .

[16]  Katsuaki Suganuma,et al.  Heat resistance of Sn-9Zn solder/Cu interface with or without coating , 2000 .