A 180MW, 450kV solid state modulator based on Press Pack IGBT technology

A new solid state power modulator for free electron laser applications is studied. This modulator comprises a 4.5kV Press Pack IGBT module that can handle pulsed currents higher than 3kA. The reliability of this module concerning current distribution among the paralleled IGBT chips is studied, where the internal parasitic components and couplings causing the asymmetries are extracted by means of the Partial Element Equivalent Circuit method. Simulated waveforms showing the currents in each IGBT chip during switching transients are revised together with the dissipated losses for different pulse durations.

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