Build-up PWB with laser-processed via holes VIL

New technologies for manufacturing build-up process PWBs(Printed Wiring Board) have been developed step by step which satisfy various requirements posed by modern electronic equipment. By applying thermosetting material to insulation and by the laser-processing of via hole through the mask imaging method, mass production of build-up type PWB having two(2) build-up layers having high reliability of interlayer connections, is achieved This type of PWB is named VIL(Variously Interconnected layers PWB). VIL PWB has merits of enabling equipment to be made smaller, providing more patterning flexibility, and higher density components mounting, thus has broader applications.