Wafer processing apparatus

The invention discloses a wafer processing device, which is characterized by comprising a processing tank and provided with an accommodating cavity which can be sealed, wherein the accommodating cavity is used for accommodating treatment fluid to process wafers; and a grabbing and lifting device, arranged on one side of the processing tank for conveying the wafers to the accommodating cavity of the processing tank. According to the wafer processing device provided by the invention, the automatic operation of a series of working procedures is achieved by the combination of the grabbing and lifting device and the processing tank, the work efficiency is greatly enhanced, the labor cost is saved, and the qualified rate is improved.