Multi-TSV Crosstalk Channel Equalization with Non-uniform Quantization

Signal transmission in 3D integrated circuits (ICs) over through-silicon via (TSV) links inherently creates coupling interference on signal TSVs. This interference can be a crucial factor for the functional correctness of 3D ICs and therefore needs to be considered in future chip designs.In this overview chapter we propose a novel multi-TSV channel equalization method deployed in the digital domain, allowing almost perfect compensation of the crosstalk by inverting the impact of the individual coupling channels. The proposed equalization technique is carried out for a TSV-to-TSV scenario with realistic I/O termination, and the corresponding performance is analyzed under consideration of analog-to-digital converter (ADC) impairments and different uniform and non-uniform quantization approaches. The results show, that even in the presence of significant ADC clock jitter and tight ADC quantization restrictions, remarkable crosstalk mitigation can be accomplished.