A calibrated pathfinding model for signal integrity analysis on interposer

A calibrated pathfinding on silicon interposer is presented for exploring the impact of interconnect geometries on signal integrity. ABCD matrix-based model and single bit method are used for the pathfinding by estimating the worst-case eye opening. Experiment-based eye-diagrams using measured S-parameters on the fabricated silicon interposer are compared with the pathfinding showing 6% max difference. The pathfinding utilizes to optimize design parameters with 99% reduce of simulation time. It also extends for the optimization of parameters in multi interconnects considering mutual effects as well as crosstalk.

[1]  Kevin Barraclough,et al.  I and i , 2001, BMJ : British Medical Journal.

[2]  W. Marsden.  I and J , 2012 .

[3]  Guoqing Chen,et al.  An RLC interconnect model based on fourier analysis , 2005, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[4]  Eby G. Friedman,et al.  Crosstalk modeling for coupled RLC interconnects with application to shield insertion , 2006, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

[5]  Joungho Kim,et al.  A precise analytical eye-diagram estimation method for non-ideal high-speed channels , 2009, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.

[6]  Kaustav Banerjee,et al.  Analysis of on-chip inductance effects for distributed RLC interconnects , 2002, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..

[7]  Yehea I. Ismail,et al.  Effects of inductance on the propagation delay and repeater insertion in VLSI circuits , 2000, IEEE Trans. Very Large Scale Integr. Syst..

[8]  Taehoon Kim,et al.  Analytical CAD Models for the Signal Transients and Crosstalk Noise of Inductance-Effect-Prominent Multicoupled $RLC$ Interconnect Lines , 2008, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[9]  Yungseon Eo,et al.  Fast eye diagram determination for the signal integrity verification of frequency-variant transmission lines , 2009, 2009 International SoC Design Conference (ISOCC).

[10]  David Blaauw,et al.  Modeling and analysis of crosstalk noise in coupled RLC interconnects , 2006, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.