3D strip meander delay line structure for multilayer LTCC-based SiP applications

Recently, the timing control of high-frequency signals is strongly demanded due to the high integration density in three-dimensional (3D) LTCC-based SiP applications. Therefore, to control the skew or timing delay, new 3D delay lines will be proposed. For frailty of the signal via, we adopt the concept of coaxial line and proposed an advanced signal via structure with quasi coaxial ground (QCOX-GND) vias. We will show the simulated results using EM and circuit simulator.

[1]  Chul Soon Park,et al.  A Fully Embedded 60-GHz Novel BPF for LTCC System-in-Package Applications , 2006, IEEE Transactions on Advanced Packaging.

[2]  B. J. Rubin,et al.  Study of meander line delay in circuit boards , 1999, IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412).

[3]  R.R. Tummala,et al.  The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade , 2004, IEEE Transactions on Advanced Packaging.

[4]  H. B. Bakoglu,et al.  Circuits, interconnections, and packaging for VLSI , 1990 .

[5]  Joungho Kim,et al.  TDR/TDT analysis by crosstalk in single and differential meander delay lines for high speed PCB applications , 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..