Creep Properties of Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC) Lead-Free Solder

Lead free solders with Sn-Ag-Cu (SAC) alloy compositions are now widely used in the electronics industry. Further enhancement of SAC solders by small addition of a forth element is aimed to improve the solder mechanical properties and the solder joint properties at the intermetallic bond interfaces. The addition of Ce to SAC solder with an alloy composition of Sn.3wt%Ag0.5wt%Cu0.019wt%Ce (SACC) shows improvement in mechanical properties. In this study, the steady state creep properties of bulk SACC lead free solder were characterized and curve fitted to constitutive models for steady-state creep behavior.

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