Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration

In this paper, the feature extraction for health monitoring based on optical measurements of transient-strain from digital image correlation (DIC) in conjunction with ultra high-speed imaging has been investigated. Full-field measurement of transient strain have been made in various board assemblies subjected to shock in various orientations. Feature-extraction for health monitoring of leadfree area array architectures based on statistical pattern recognition has been presented. Previous researchers have measured the transient-dynamics of board assemblies with high-speed imaging in conjunction with high-speed image analysis for measurement of relative displacement, angle, velocity, and acceleration [Lall 2006, Che 2006], high-speed data-acquisition systems with discrete strain gages [Lall 2004, 2005, Liang 2005] and with accelerometers for measurement of transient acceleration [Dunford 2004, Goyal 2000, Seah 2005]. Degradation in confidence value gives a leading indication of component failure. Package architectures examined include-flex ball-grid arrays, tape-array ball-grid arrays, and metal lead-frame packages. Statistical pattern recognition techniques including, mahalanobis- distance approach, wavelet packet energy decomposition, and time-frequency (TFA) techniques have been investigated for system identification, condition monitoring, and fault detection and diagnosis in electronic systems. Explicit finite element models have been developed and various kinds of failure modes have been simulated such as solder ball cracking, package fall off and solder ball failure. Models developed include, smeared property models, Timoshenko-beam models, and explicit sub-models. Explicit finite-element models have been correlated with experimental data. The presented approach does not depend on continuity and therefore does not need daisy-chained devices for detection of failure.

[1]  Hugo Sol,et al.  Full-field optical measurement for material parameter identification with inverse methods , 2006 .

[2]  B. Boashash,et al.  Time-frequency signal analysis and instantaneous frequency estimation: methodology, relationships and implementations , 1989, IEEE International Symposium on Circuits and Systems,.

[3]  Jay Lee,et al.  Machine performance monitoring and proactive maintenance in computer-integrated manufacturing: review and perspective , 1995 .

[4]  Y.L. Zhang,et al.  Effect of hygrothermal aging on interfacial reliability of flip chip on board (FCOB) assembly , 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

[5]  K. Tu,et al.  Impact reliability of solder joints , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[6]  Tzu-Hsien Sang,et al.  Adaptive RID kernels which minimize time-frequency uncertainty , 1994, Proceedings of IEEE-SP International Symposium on Time- Frequency and Time-Scale Analysis.

[7]  L. Kehoe,et al.  Measurement of deformation and strain in first level C4 interconnect and stacked die using optical digital image correlation , 2006, 56th Electronic Components and Technology Conference 2006.

[8]  P. Lall,et al.  Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact , 2004, IEEE Transactions on Components and Packaging Technologies.

[9]  Chen Liang,et al.  Application of active structural health monitoring technique to aircraft fuselage structures , 1996, Smart Structures.

[10]  Jeffrey D. Helm,et al.  Improved three-dimensional image correlation for surface displacement measurement , 1996 .

[11]  Jechang Jeong,et al.  Kernel design for reduced interference distributions , 1992, IEEE Trans. Signal Process..

[12]  David J. Whitehouse,et al.  The Application of the Wigner Distribution Function to Machine Tool Monitoring , 1992 .

[13]  P. Lall,et al.  Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies , 2006, 56th Electronic Components and Technology Conference 2006.

[14]  Russell Tessier,et al.  Testing and diagnosis of interconnect faults in cluster-based FPGA architectures , 2002, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..

[15]  Jay Lee,et al.  Multisensor Process Performance Assessment Through Use of Autoregressive Modeling and Feature Maps , 2003 .

[16]  A. Grossmann,et al.  DECOMPOSITION OF HARDY FUNCTIONS INTO SQUARE INTEGRABLE WAVELETS OF CONSTANT SHAPE , 1984 .

[17]  B. Nandagopal,et al.  Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints , 2008, IEEE Transactions on Components and Packaging Technologies.

[18]  J. Mayer,et al.  On the Quantum Correction for Thermodynamic Equilibrium , 1947 .

[19]  Peng Zhou,et al.  Subpixel displacement and deformation gradient measurement using digital image/speckle correlation (DISC) , 2001 .

[20]  L. Cohen,et al.  Time-frequency distributions-a review , 1989, Proc. IEEE.

[21]  Larry P. Heck,et al.  Mechanical system monitoring using hidden Markov models , 1991, [Proceedings] ICASSP 91: 1991 International Conference on Acoustics, Speech, and Signal Processing.

[22]  Metin Akay,et al.  Wavelet applications in medicine , 1997 .

[23]  Bernd Michel,et al.  MicroDAC strain measurement for electronics packaging structures , 2001 .

[24]  X.Q. Shi,et al.  Effect of Loading Mode, Temperature and Moisture on Interface Fracture Toughness of Silicon/Underfill/Silicon Sandwiched System , 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

[25]  Peng Zhou,et al.  Methodology for predicting solder joint reliability in semiconductor packages , 2002, Microelectron. Reliab..

[26]  Kuo-Chung Lin,et al.  Wavelet packet feature extraction for vibration monitoring , 1999, IJCNN'99. International Joint Conference on Neural Networks. Proceedings (Cat. No.99CH36339).

[27]  P. Lall,et al.  Health Monitoring for Damage Initiation and Progression During Mechanical Shock in Electronic Assemblies , 2008, IEEE Transactions on Components and Packaging Technologies.

[28]  Yiu-Wing Mai,et al.  Understanding and Testing for Drop Impact Failure , 2005 .

[29]  Jay Lee,et al.  Degradation Assessment and Fault Modes Classification Using Logistic Regression , 2005 .

[30]  Khaled H. Hamed,et al.  Time-frequency analysis , 2003 .

[31]  K. Newman,et al.  BGA brittle fracture - alternative solder joint integrity test methods , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[32]  S.W. Wegerich.  Similarity based modeling of time synchronous averaged vibration signals for machinery health monitoring , 2004, 2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720).

[33]  Elijah Kannatey-Asibu,et al.  Hidden Markov model-based tool wear monitoring in turning , 2002 .

[34]  Patrick J. Loughlin,et al.  What are the joint time-frequency moments of a signal? , 1996, 1996 IEEE International Conference on Acoustics, Speech, and Signal Processing Conference Proceedings.

[35]  Jechang Jeong,et al.  A new formulation of generalized discrete-time time-frequency distributions , 1991, [Proceedings] ICASSP 91: 1991 International Conference on Acoustics, Speech, and Signal Processing.

[36]  Richard E. Martin,et al.  Vibration Based Crack Detection in a Rotating Disk , 2003 .

[37]  Stephen J. Engel,et al.  Prognostics, the real issues involved with predicting life remaining , 2000, 2000 IEEE Aerospace Conference. Proceedings (Cat. No.00TH8484).

[38]  K. H. LAW,et al.  An Enhanced Statistical Damage Detection Algorithm Using Time Series Analysis , 2003 .

[39]  Jay Lee,et al.  Intelligent diagnosis in electromechanical operation systems , 2004, IEEE International Conference on Robotics and Automation, 2004. Proceedings. ICRA '04. 2004.

[40]  P. Lall,et al.  Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging , 2008, IEEE Transactions on Components and Packaging Technologies.

[41]  Patrick J. Loughlin,et al.  Instantaneous frequency and time-frequency distributions , 1995, 1995 International Conference on Acoustics, Speech, and Signal Processing.

[42]  Jay Lee,et al.  A prognostic algorithm for machine performance assessment and its application , 2004 .

[43]  D. Amodio,et al.  Digital speckle correlation for strain measurement by image analysis , 2003 .

[44]  S. Canumalla,et al.  Package to board interconnection shear strength (PBISS) behavior at high strain rates approaching mechanical drop , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[45]  Timothy J. Miller,et al.  High-speed multi-camera DIC for finite element model validation:Part 1. , 2006 .

[46]  Jun Ni,et al.  Time-Frequency Based Sensor Fusion in the Assessment and Monitoring of Machine Performance Degradation , 2002 .

[47]  S. Lee,et al.  Investigation of IMC thickness effect on the lead-free solder ball attachment strength: comparison between ball shear test and cold bump pull test results , 2006, 56th Electronic Components and Technology Conference 2006.

[48]  G. A. Hickman,et al.  Application of Smart Structures to Aircraft Health Monitoring , 1991 .

[49]  P. Lall,et al.  Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling , 2006, IEEE Transactions on Electronics Packaging Manufacturing.

[50]  Zhaowei Zhong,et al.  Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[51]  P. Lall,et al.  Life Prediction and Damage Equivalency for Shock Survivability of Electronic Components , 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

[52]  K. Reichard,et al.  Using torsional vibration analysis as a synergistic method for crack detection in rotating equipment , 2004, 2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720).

[53]  S. Santoso,et al.  Power quality assessment via wavelet transform analysis , 1996 .

[54]  M. Hedley,et al.  Sensor network for structural health monitoring , 2004, Proceedings of the 2004 Intelligent Sensors, Sensor Networks and Information Processing Conference, 2004..

[55]  R. F. Favero.  Compound wavelets: wavelets for speech recognition , 1994, Proceedings of IEEE-SP International Symposium on Time- Frequency and Time-Scale Analysis.

[56]  Artur Wymyslowski.  Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems , 2007, Microelectron. Reliab..

[57]  Amy E. Bell,et al.  New image compression techniques using multiwavelets and multiwavelet packets , 2001, IEEE Trans. Image Process..

[59]  Gary D. Bernard,et al.  Applications of time-frequency analysis to signals from manufacturing and machine monitoring sensors , 1996, Proc. IEEE.

[60]  Shantanu Dutt,et al.  Mixed PLB and interconnect BIST for FPGAs without fault-free assumptions , 2006, 24th IEEE VLSI Test Symposium.

[61]  Bernhard Sick.  Online tool wear monitoring in turning using time-delay neural networks , 1998, Proceedings of the 1998 IEEE International Conference on Acoustics, Speech and Signal Processing, ICASSP '98 (Cat. No.98CH36181).

[62]  Jing Fang,et al.  Thermal deformation analysis of BGA package by digital image correlation technique , 2005 .

[63]  E. K. Buratynski,et al.  Methods for realistic drop-testing , 2000 .

[64]  Yu Fu,et al.  Wavelets and singularities in bearing vibration signals , 2003, Proceedings of the 2003 International Conference on Machine Learning and Cybernetics (IEEE Cat. No.03EX693).

[65]  W. D. Mark.  Spectral analysis of the convolution and filtering of non-stationary stochastic processes , 1970 .

[66]  Xunqing Shi,et al.  Thermal Deformation Measurement by Digital Image Correlation Method , 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

[67]  Voula C. Georgopoulos,et al.  A non-negative approximate Wigner distribution with accurate low-order moments , 1997, Proceedings of 13th International Conference on Digital Signal Processing.

[68]  T. Baughn,et al.  High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation , 2005 .

[69]  Jechang Jeong,et al.  Alias-free generalized discrete-time time-frequency distributions , 1992, IEEE Trans. Signal Process..

[70]  Chuang Fu,et al.  Predictive maintenance in intelligent-control-maintenance-management system for hydroelectric generating unit , 2004, IEEE Transactions on Energy Conversion.

[71]  D. Amodio,et al.  Digital speckle correlation for strain measurement by image analysis , 2003 .

[72]  Fabrizio Lombardi,et al.  Analysis and measurement of fault coverage in a combined ATE and BIST environment , 2004, IEEE Transactions on Instrumentation and Measurement.

[73]  K. P. Logan,et al.  Prognostic software agents for machinery health monitoring , 2003, 2003 IEEE Aerospace Conference Proceedings (Cat. No.03TH8652).

[74]  Benoît Iung,et al.  Predictive maintenance in intelligent-control-maintenance-management system for hydroelectric generating unit , 2004 .

[75]  Andreas Steininger,et al.  Testing and built-in self-test - A survey , 2000, J. Syst. Archit..

[76]  Ka-Ming Lau,et al.  Climate Signal Detection Using Wavelet Transform: How to Make a Time Series Sing , 1995 .

[77]  Luhua Xu,et al.  Combined thermal and electromigration exposure effect on SnAgCu BGA solder joint reliability , 2006, 56th Electronic Components and Technology Conference 2006.

[78]  Y Shao,et al.  Prognosis of remaining bearing life using neural networks , 2000 .