Fabrication Processes for Sensors for Automotive Applications: A Review

MEMS technology has revolutionized the industries of twenty-first century by combining the micromachining technology with the silicon microelectronics. The miniaturized devices produced from MEMS-based fabrication process have good adaptability and flexibility due to its low power consumption and compactness. MEMS devices are hugely deployed for automobiles sectors like accelerometer, gyroscopes, pressure sensors, etc. These devices are fabricated through batch fabrication in industries, using various types of fabrication technologies. In this chapter, first we have given an overview about MEMS. In the second section, we have given details about various kinds of materials which are utilized in the formation of sensors. In the third, fourth, and fifth sections, in details, different lithographic, bulk, and surface micromachining techniques, and thin film deposition techniques are discussed. At the last section, we have mentioned recent progress in MEMS-based processes, which are presently used mostly in atomic level for the fabrication of sensor and devices for automotive application.

[1]  Ivo W. Rangelow,et al.  Dry etching-based silicon micro-machining for MEMS , 2001 .

[2]  Robert L. Bruce,et al.  Fluorocarbon assisted atomic layer etching of SiO2 and Si using cyclic Ar/C4F8 and Ar/CHF3 plasma , 2016 .

[3]  J Benjamin.,et al.  A Review of Different Etching Methodologies andImpact of various etchants in Wet Etching in MicroFabrication , 2014 .

[4]  D. Sobha Jayakrishnan,et al.  Electrodeposition: the versatile technique for nanomaterials , 2012 .

[5]  Alok Ranjan,et al.  Quasi-atomic layer etching of silicon nitride , 2017 .

[6]  P. Hammond,et al.  Vapor Phase Etch Processes for Silicon MEMS , 2015 .

[7]  Yoshihiro Hirata,et al.  LIGA process – micromachining technique using synchrotron radiation lithography – and some industrial applications , 2003 .

[8]  Volker Saile,et al.  Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and -systems: a review , 2004, Microelectron. J..

[9]  Han-Bo-Ram Lee,et al.  Applications of atomic layer deposition to nanofabrication and emerging nanodevices , 2009 .

[10]  Florin Udrea,et al.  A maskless etching technique for fabrication of 3D MEMS structures in SOI CMOS devices , 2018 .

[11]  Xueyan Song,et al.  Stabilizing nanostructured solid oxide fuel cell cathode with atomic layer deposition. , 2013, Nano letters.

[12]  Shantanu Bhattacharya,et al.  Fabrication and resilience measurement of thin aluminium cantilevers using scanning probe microscopy , 2016 .

[13]  M. Madou,et al.  One-step maskless grayscale lithography for the fabrication of 3-dimensional structures in SU-8 , 2011 .

[14]  G. Whitesides,et al.  Paper-based piezoresistive MEMS sensors. , 2011, Lab on a chip.

[15]  Jin Xie,et al.  Fabrication challenges and test structures for high-aspect-ratio SOI MEMS devices with refilled electrical isolation trenches , 2015 .

[16]  M. Madou.  Fundamentals of microfabrication , 1997 .

[17]  Dong Woo Kim,et al.  Atomic Layer Etching Mechanism of MoS2 for Nanodevices. , 2017, ACS applied materials & interfaces.

[18]  F. Prinz,et al.  High stability thermal accelerometer based on ultrathin platinum ALD nanostructures , 2018, 2018 IEEE Micro Electro Mechanical Systems (MEMS).

[19]  K. Sumangala,et al.  Design and Analysis of MEMS Comb Drive Capacitive Accelerometer for SHM and Seismic Applications , 2016 .

[20]  Asima Pradhan,et al.  BSA Detection on Polymeric Nanocantilever , 2019, Lecture Notes in Mechanical Engineering.

[21]  Minhang Bao,et al.  Maskless etching of three-dimensional silicon structures in KOH , 1996 .

[22]  S. Sriraman,et al.  Atomic layer etching of 3D structures in silicon: Self-limiting and nonideal reactions , 2017 .