Wire bonding quality monitoring via refining process of electrical signal from ultrasonic generator
暂无分享,去创建一个
[1] Z. W. Zhong,et al. Investigation of ultrasonic vibrations of wire-bonding capillaries , 2006, Microelectron. J..
[2] Shih-Fu Ling,et al. Real-Time Quality Evaluation of Wire Bonding Using Input Impedance , 2006, IEEE Transactions on Electronics Packaging Manufacturing.
[3] Helen Lai Wa Chan,et al. Smart ultrasonic transducer for wire-bonding applications , 2002 .
[4] M. Gaitan,et al. Wire-bonding process monitoring using thermopile temperature sensor , 2005, IEEE Transactions on Advanced Packaging.
[5] Kei Chun Cheng,et al. Characterization of piezoelectric ring used for wire bonding transducer application , 2001, Proceedings 2001 IEEE Hong Kong Electron Devices Meeting (Cat. No.01TH8553).
[6] N.M. Bilgutay,et al. Analysis of impedance loading in ultrasonic transducer systems , 1988, IEEE 1988 Ultrasonics Symposium Proceedings..
[7] Saeed V. Vaseghi,et al. Advanced Digital Signal Processing and Noise Reduction , 2006 .
[8] Shih-Fu Ling,et al. Monitoring wire bonding via time-frequency analysis of horn vibration , 2003 .
[9] G. Harman,et al. Wire bonding in microelectronics , 2010 .
[10] Siu Wing Or,et al. Ultrasonic wire-bond quality monitoring using piezoelectric sensor , 1998 .
[11] R. Pufall,et al. Automatic process control of wire bonding , 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
[12] H. Reichl,et al. Predicting the Shear Strength of a Wire Bond Using Laser Vibration Measurements , 2006, 2006 1st Electronic Systemintegration Technology Conference.