사각채널의 기하학적 형상에 따른 다칩모듈 냉각 특성

The present study investigated the cooling characteristics of multichip modules which are flush mounted to top wall of the rectangular channels with different aspect ratios and chip spaces using water. Four key experimental parameters were heat flux, Reynolds numbers, the aspect ratio of the rectangular channel, and the chip spaces in multichip modules. The measured friction factors gave a good agreement with the modified Blasius equation within ±7%. Nusselt number increased as the aspect ratio decreased, but the increasing rate of Nusselt number reduced as the aspect ratio decreased. A rectangular channel with an aspect ratio of 0.20 yielded the most efficient cooling characteristics when the heat transfer and pressure drop in the test section were considered simultaneously. The removable heat flux ranges for a 4×3 multichip module were obtained when the surface temperature limit was 85℃.