Molded interconnect device (MID) design for base station antenna elements

Molded Injection Device (MID) technology enables the fabrication of 3D metalized plastic structures opening a new open design space for antenna applications. Even if in the past years this technology has reached a high degree of process maturity in various industries as well as academic areas, the use of it for macro cellular antenna applications still remain not fully explored. In this work, the use of MID technology for Ultra Wideband (UWB) base-station antenna applications is investigated. Simulation results and measurements show the feasibility of the use of MID in the base station antenna domain in terms of RF-design and performance.