FPGA capability expansion despite technology challenges
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FPGA (Field Programmable Gate Array) has been continually growing – expanding functionality, improving powerperformance and enlarging capacity, in past several decades. Moore’s Law has been gradually slowing down and technology becomes more expensive in past several nodes. However with continual architecture, design and technology innovations, FPGA’s capacity expansion continues, beyond Moore’s Law. 3D-IC, embedded processing SOC, HBM integration, RF-SOC and furthermore, coming Versal ACAP (Adaptive Compute Acceleration Platform) family, ensures more and more suitable applications in data centers, machine learning (ML), 5G, automotive and many other applications in coming years.
[1] Suresh Ramalingam. HBM package integration: Technology trends, challenges and applications , 2016, 2016 IEEE Hot Chips 28 Symposium (HCS).
[2] G.E. Moore,et al. Cramming More Components Onto Integrated Circuits , 1998, Proceedings of the IEEE.